Achieve smaller, smarter packaging with Veco’s lead frame
A lead frame is a thin layer of metal frame to which semiconductors are attached during the package assembly process. Quality of the lead frame is of essential importance: any tiny defect seriously endangers the performance and reliability of the result IC device.
Continuous development of semiconductor process and design technologies has led to growing demand of thinner, smaller, and more complicated devices and packaging solutions. Etched and electroformed lead frames become obvious choices than stamped ones given their superior precision features, ultra fine tolerances and much shorter delivery time (1/10 of stamping).
Our lead frame solutions
Veco is a world leading specialist in electroforming, photo-etching as well as laser cutting. With our unmatched flexible tooling capabilities, we provide the semiconductor industry customized solution of high precision lead frame based on every specific demand of complexity, miniaturization, and feature design to achieve thinner package, smaller footprint, higher density, and better performance.
|Materials||Electroformed: Nickel (190-600 HV)
Etched: Typically Kovar and Dilver P but most metals are suitable
|Coating||Copper, silver, palladium-Ni, silver, nickel, gold, tin, etc.|