Improve efficiency of refinishing with Veco’s quality rework stencils
In electronic assembly, refinishing or repair of a certain component is not infrequent. Rework stencils used in the process accurately mimic the footprints and aperture sizes corresponding to both device requirement and original stencils used in production to ensure precise registration of the new solder spheres onto pre-printed flux deposits.
Our rework stencil solutions
Veco provides the industry with a variety of high quality rework solutions including dip transfer plates, BGA re-balling stencils, direct component printing stencils, reflow reflector shields, as well as specified rework stencils. Although a rework stencil might only be used for single components, its quality, design and sustainability are examined exactly as a complete stencil product.
Offering optimum reliability and consistent printed results, our rework stencils are both strong and rigid to ensure positive gasketing with the PCB surface. The compact designs include minimal stencil projection beyond the image to be printed thereby enabling use in all situations, especially high-density component areas. Accurately folded edges and run-on / run-off
areas ensure effective paste roll and containment without causing interference to other components on the populated PCB.
Veco offers customized solution upon various specified features in terms of:
- aperture size/shape
- stencil thickness
- aspect ratio/area ratio
- paste release/wall roughness
- solder paste rheology/particle size
|Aperture size||from 50 μm to several mm’s|
|Spacing||from 50 μm to several mm’s|