design guideline for engineers
Explore three cutting-edge processes: Electroforming Overgrowth, Thick Resist, and Surface Replication. Perfect for high-precision replication, our methods ensure superior edge definition and tight tolerances.
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Electroforming design guideline: available processes
At Veco we offer 3 types of Electroforming: Electroforming Overgrowth, Electroforming Thickresist, and Surface Replication with Electroforming.
(1) plating defined Electroforming: the Overgrowth method
Plating defined electroforming is also referred to as an overgrowth method.
It uses a thin photoresist pattern to shield parts of the conductive substrate. A light-sensitive coating is applied to the conductive surface. By a photolithographic process a pattern is made in the coating, resulting in conducting and non conducting areas. Metal grows over the photoresist and the thickness of the product (T) exceeds the thickness of the photoresist (TR), hence the process is also known as overgrowth.
(2) photo defined Electroforming: the Thick Resist method
Photo defined electroforming is also called the thick resist method.
In some cases, it is desired to use the thick resist method. A thick pattern of photoresist is used during photo defined growth, such that the thickness of the product (T) does not exceed the thickness of the photoresist (TR).
Aspect ratios (TR/ WR) up to 1 can generally be achieved with ease. The exact limits depend on the size and geometry of the products .
(3) surface replication with Electroforming
The electroforming process allows for extremely precise duplication of the mandrel. The high resolution of the conductive patterned substrate allows finer geometries, tighter tolerances, and superior edge definition.
This results in perfect process control, high-quality production and very high repeatability.
Electroforming is therefore perfectly suitable for high precision surface replication at low cost and in high volumes.
