the process of Electroforming
Learn everything about Advanced Lithographic Electroforming process, material properties and design guidelines
Learn everything about Advanced Lithographic Electroforming process, material properties and design guidelines
Veco's Advanced Lithographic Electroforming process is a unique combination of high precision photolithography and electrodeposition based Electroforming.
3) Exposing
The substrate is exposed to ultraviolet (UV) laser direct imaging (LDI), whereby the CAD part pattern is projected and transferred onto its surface. The resulting patterned surface is split into conductive areas and non-conductive areas by the photoresist material hardening in the latter.
5) Electrodeposition
The electrodeposition process takes place in an electrolytic bath and involves two electrodes (an anode and a cathode) and an electrolytic solution. The mandrel is placed in the bath and the electrodes pass a DC through the solution. The DC converts metallic ions into atoms that are continuously deposited on the conductive areas of the mandrel until the desired metal thickness has been achieved.
6) Harvesting
The electroformed part is harvested, or separated, from the mandrel. The electroforming process can be managed in different ways to achieve different product features. For example, if a thin photoresist is used and the metal is allowed to grow over it, resulting in the thickness of the part exceeding that of the photoresist, the outer edges will be rounded and have a bell mouth shape. Alternatively, if a thick photoresist is used and the metal is not allowed to grow over it, resulting in the thickness of the part being less than the thickness of the photoresist, the outer and inner edges will be straight and sharp.
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(1) Plating Defined Electroforming: the Overgrowth Method
Plating defined electroforming is also referred to as an overgrowth method. It uses a thin photoresist pattern to shield parts of the conductive substrate. A light-sensitive coating is applied to the conductive surface. By a photolithographic process a pattern is made in the coating, resulting in conducting and non conducting areas. Metal grows over the photoresist and the thickness of the product (T) exceeds the thickness of the photoresist (TR), hence the process is also known as overgrowth.
(2) Photo Defined Electroforming: the Thick Resist Method
Photo defined electroforming is also called the thick resist method. In some cases, it is desired to use the thick resist method. A thick pattern of photoresist is used during photo defined growth, such that the thickness of the product (T) does not exceed the thickness of the photoresist (TR).
Aspect ratios (TR/ WR) up to 1 can generally be achieved with ease. The exact limits depend on the size and geometry of the products .
(3) Surface replication with Electroforming
The electroforming process allows for extremely precise duplication of the mandrel. The high resolution of the conductive patterned substrate allows finer geometries, tighter tolerances, and superior edge definition.
This results in perfect process control, high-quality production and very high repeatability.
Electroforming is therefore perfectly suitable for high precision surface replication at low cost and in high volumes.
See below an overview of materials available for the electroforming process
The materials we offer for electroforming are Nickel and Copper. Whereas we have a variety of nickel types available:
Veco84, Sulfamate, Meta, Hr-Ni (heat-resistant), and PdNi (biocompatible).
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