Achieve smaller, smarter packaging with Veco’s lead frame
A lead frame is a thin layer of metal frame to which semiconductors are attached during the package assembly process. Quality of the lead frame is of essential importance: any tiny defect seriously endangers the performance and reliability of the result IC device.
Continuous development of semiconductor process and design technologies has led to growing demand of thinner, smaller, and more complicated devices and packaging solutions. Etched and electroformed lead frames become obvious choices than stamped ones given their superior precision features, ultra fine tolerances and much shorter delivery time (1/10 of stamping).