Keep an eye for details with Veco's multi-level stencils
The mix of components on electronic assemblies now includes the finest of pitched devices alongside surface mount connectors and power components requiring more paste. A thinner stencil will ensure the finest pitch printed results are good but other components may be starved of the paste volume they require.
The solution is a multi-level stencil, with a general overall thickness and a specific local thickness reduction tailored to the fine pitch components.
Veco provides the industry with 3 major types of multilevel stencils for optimizing the printing process. With a multi-level stencil co-planarity problems can be eliminated, along with non-productive rework time at the end of the line to "cure" the problem.