In electronic assembly, refinishing or repair of a certain component is not infrequent. Rework stencils used in the process accurately mimic the footprints and aperture sizes corresponding to both device requirement and original stencils used in production to ensure precise registration of the new solder spheres onto pre-printed flux deposits.
Veco provides the industry with a variety of high quality rework solutions including dip transfer plates, BGA re-balling stencils, direct component printing stencils, reflow reflector shields, as well as specified rework stencils. Although a rework stencil might only be used for single components, its quality, design, and sustainability are examined exactly as a complete stencil product. Veco offers customized solution upon various specified features in terms of: • aperture size/shape • stencil thickness • aspect ratio/area ratio • paste release/wall roughness • solder paste rheology/particle size
Improve efficiency of refinishing with Veco’s quality rework stencils